Finally the life of CSP solder joint based on Pb-free material 95.

基于三维有限元分析方法预测热循环条件下焊点的疲劳寿命，对无铅材料95。

Ball Valves Threaded, Socket-Welding, Solder Joint, Grooved and Flared Ends.

球阀线程，插焊，焊点，槽和扩口端。

Therefore, it is necessary to study the reliability of this mixed solder joint.

因此，有必要对这种混合焊点进行可靠性分析。

The results are of importance to design and optimize of geometry shape of the solder joint.

这一结果对于焊点几何形态的设计及优化具有指导意义。

Thermal fatigue Random variable Probabilistic analysis Solder joint Lognormal distribution;

热疲劳； 随机变量； 概率分析； 焊点； 对数正态分布；