Experimental study of laser milling of silicon wafer.

单晶硅的激光铣削试验研究。

The new device is a silicon wafer about the shape and size of a playing card.

这个新设备是一张纸牌大小的硅晶片。

Using silicon wafer as substrate makes compatibility with IC technology possible.

使用硅片作为衬底使得与IC工艺的兼容成为可能。

By the halfwidth of rocking curve we can estimate the bending stress of silicon wafer.

从双晶衍射半峰宽值可以评估硅片的抗弯强度。

Fabrication of solar silicon wafer consists of wafer slicing and texturing of its surface.

太阳能硅片的制造工艺主要包括硅片的切割以及绒面制备两部分。